Microscope image of electromigration-induced hillock and void
Por um escritor misterioso
Descrição
A void and a hillock generated by electromigration [10]
New Insights into Dewetting of Cu Thin Films Deposited on Si
PDF) Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
Electromigration Encyclopedia MDPI
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
Materials Quest for Advanced Interconnect Metallization in Integrated Circuits - Moon - 2023 - Advanced Science - Wiley Online Library
Micrographs of a 5 m wide Al ͑ Cu ͒ line: ͑ a ͒ before and ͑ b ͒
A Review of the Study on the Electromigration and Power Electronics
High magnification SEM micrograph of the notch area after
Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling, MRS Communications
PDF] Electromigration in bamboo aluminum interconnects
Micromachines, Free Full-Text
